微观结构的不稳定性及其对SnSe和Na-doped SnSe的热电特性的影响
Chun-Wan Timothy Lo1, Shaochang Song1, Yu-Chih Tseng2
1Department of Chemistry and Chemical Biology, McMaster University, Hamilton, ON L8S 4M1, Canada.
ACS applied materials & interfaces
|September 4, 2024
概括
热循环会在添加的锡化物 (SnSe) 中产生裂,降低热电性能. 微裂纹的方向受杂质的影响,显著影响材料的稳定性和性能.
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 热电学是一种热电学.
背景情况:
- 锡化 (SnSe) 是一个有前途的热电材料.
- 微观结构和缺陷显著影响热电特性.
- 热循环可以改变材料的性能和性能.
研究的目的:
- 为了研究热循环对无兴奋剂和纳兴奋剂SnSe的微观结构和热电特性的影响.
- 了解杂质和裂方向在材料降解中的作用.
- 为了评估热处理后SnSe的机械稳定性.
主要方法:
- 用于微观结构分析的X射线计算机断层扫描.
- 热电性能测量 (电导率,热导率,热电力).
- 在热循环下分析裂纹形成和谷物生长.
主要成果:
- 热循环诱导了SnSe的显著裂纹,减少了电和晶格导热率.
- 经过重复的热处理后,优点 (zT) 的数字大幅下降.
- 杂质会影响裂的方向,影响谷物生长和整体微观结构.
- 所有样本都显示了循环后的机械不稳定.
结论:
- 热循环降低了SnSe的热电性能,主要是通过裂形成.
- 裂的方向受到Na-doping和杂质的影响,在微观结构进化和属性变化中起着关键作用.
- 精确的导热度测量需要考虑到循环过程中的密度变化.
- 在重复的热应力下,SnSe材料表现出不良的机械稳定性.
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