相关实验视频
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Fabrication of Silica Ultra High Quality Factor Microresonators
Published on: July 2, 2012
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超低损耗化变得更加凉爽
Dawn T H Tan1,2, Xavier X Chia3
1Photonics Devices and Systems Group, Singapore University of Technology and Design, Singapore, Singapore. dawn_tan@sutd.edu.sg.
Light, science & applications
|September 4, 2024
概括
超低损耗化,利用化前体并与CMOS处理兼容,为光子集成电路的广泛采用提供了潜力.
科学领域:
- 材料科学 材料科学 材料科学
- 光子学是指光子学的使用方法.
- 半导体制造业 半导体制造业
背景情况:
- 化 (SiN) 是光子集成电路 (PIC) 的关键材料,因为它的光学损耗很低.
- 实现SiN的超低损耗对于推进PIC技术至关重要.
- 当前的制造方法可能对广泛集成有局限性.
研究的目的:
- 开发一种超低损失的化制造工艺.
- 为了确保与现有的补充金属氧化物半导体 (CMOS) 制造业的兼容性.
- 促进在PIC中更广泛地采用SiN.
主要方法:
- 用于化沉积的使用化前体.
- 采用与后端CMOS制造相容的低热预算工艺.
- 具有特征的光学损失和材料性能.
主要成果:
- 在化波导中实现了超低的光学损失.
- 在标准CMOS后端条件下证明了过程兼容性.
- 制造业是适合大规模生产的.
结论:
- 化前体和低热预算使得化的超低损耗成为可能.
- 开发的过程加速了SiN在PIC中广泛使用的潜力.
- 这一进步支持光子学与电子学的整合.
相关概念视频
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