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基于功能性水凝的电子皮肤贴片用于加快皮肤伤口的愈合和监测皮肤伤口

Yoonsoo Shin¹, Hyun Su Lee¹, Jeong-Uk Kim²

¹Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea; School of Chemical and Biological Engineering and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea.

|September 10, 2024

概括

这项研究介绍了一种用于软生物电子的全水凝电子皮肤 (e-skin) 补丁. 电子皮肤贴片可以通过电刺激和药物输送来加速伤口愈合和监测,为组织接口提供了新的可能性.

科学领域:

材料科学与工程材料科学与工程
生物医学工程生物医学工程
软电子是软电子的产品之一.

背景情况:

导电性水凝为生物集成电子产品提供电性能和类似组织的软度.
挑战仍然存在于功能性水凝的易于模式化和单立体集成,用于全水凝软生物电子.

研究的目的:

报告全水凝电子皮肤 (e-skin) 补丁的材料设计,制造和整合策略.
为了证明e-skin贴片在加快伤口愈合和监测方面的有效性.

主要方法:

使用光刻法兼容的功能性水凝制造电子皮肤贴片:PHEA (基板),Ag片 (互连),PEDOT:PSS (工作电极),PDA (组织粘合剂) 和PVA (封装).
描述水凝的特性,包括导电性,阻抗和剪切强度.
在小鼠模型中体内证明加速伤口愈合和监测,使用电场刺激和离子体外药物输送.

主要成果:

功能性水凝模仿人体组织特性 (含水量,模量) 以实现稳定的组织-设备接口.
Ag片状水凝实现了高导电性 (∼571.43 S/cm),PEDOT:PSS水凝表现出低阻抗 (∼69.84 Ω @ 1 Hz),PDA水凝显示出高切削强度 (∼725.1 kPa).
电子皮肤贴片成功促进了纤维细胞迁移,增殖和分化,并通过阻抗映射监测加速伤口愈合.

结论:

一个全凝电子皮肤贴片成功设计,制造和集成用于软生物电子.
开发的e-skin贴片显示了促进和监测加速伤口愈合的巨大潜力.
预计这项技术将为临床相关的组织接口应用开辟新的途径.

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