低温Cu-Cu在空气环境中直接结合,通过超快速的表面谷物生长
Yun-Fong Lee1, Yu-Chen Huang1, Jui-Sheng Chang1
1Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
Royal Society open science
|September 12, 2024
概括
在130°C的空气中使用近原子表面的细粒度Cu薄膜实现直接铜 (Cu) 粘合. 超快速的谷物生长使结合能够在没有先进的后处理的情况下进行结合,这对于微电子非常重要.
科学领域:
- 材料科学 材料科学 材料科学
- 表面科学是一门学科.
- 纳米技术纳米技术
背景情况:
- 直接的铜 (Cu) 粘合对于先进的包装和互连是必不可少的.
- 实现低温,空气环境的Cu-Cu结合仍然是一个重大挑战.
- 现有的方法通常需要复杂的表面处理或高真空.
研究的目的:
- 为了在空气环境中在低温 (130°C) 下证明直接的Cu-Cu结合.
- 调查细粒度结构和表面形态在使Cu-Cu结合的作用.
- 为了评估粘合条件下的细粒度Cu薄膜的生长率.
主要方法:
- 电细粒铜 (Cu) 薄膜,控制粒度 (100.36 nm) 和近原子表面粗度 (0.39 nm).
- 在130°C的环境空气中进行的直接粘合实验,最低压力为1MPa.
- 对薄膜增长速度和粘合后表面形态的分析.
主要成果:
- 在没有先进的表面后处理的情况下,在130°C的空气中成功实现了直接Cu-Cu粘合.
- 第一天的瞬间增长率为164.29nm/day.
- 平均增长率为218.185nm/天 (第一天) 和105.58nm/天 (第一14天).
结论:
- 超快的谷物生长和接近原子尺寸的表面是低温,空气环境Cu-Cu直接结合的关键因素.
- 细粒度的Cu薄膜在粘合界面上促进了粒度边界运动.
- 这种方法为先进的Cu互连提供了一种简化方法.
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