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面膜对印刷电路板上的电化学迁移的影响

Markéta Klimtová¹, Petr Veselý¹, Iva Králová¹

¹Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Technická 2, 160 00 Prague, Czech Republic.

Materials (Basel, Switzerland)

|September 14, 2024

概括

更粗的面膜和铜定义可以减少印刷电路板 (PCB) 上的电化学迁移 (ECM). 然而,不清洁的流体残留物可以覆盖这些保护作用,因此需要在接后去除流体以提高PCB的可靠性.

科学领域:

材料科学材料科学材料科学
电气工程电气工程
可靠性工程可靠性工程

背景情况:

电化学迁移 (ECM) 对电子设备中的印刷电路板 (PCB) 提出了重大可靠性挑战.
有限的研究已经研究了面膜和贴设计在缓解ECM方面的特定作用.
了解这些设计因素对于改善电子产品的寿命至关重要.

研究的目的:

为了评估不同的面膜粗度和片设计如何影响PCB上ECM的易受性.
评估非清洁流量残留物对ECM行为以及这些设计变化的影响.

主要方法:

在热气平面涂层PCB上使用了水滴测试和热湿度偏差测试.
检查了使用无清洁糊的PCB,以分析流量残留的影响.
不同的面膜粗度和使用不同的片设计 (例如,铜定义片).

主要成果:

增加面膜粗性被发现可以通过作为物理屏障来抑制树突生长,从而显著抑制ECM.
铜定义显示出较低的ECM易感性,可能是由于类似的机械屏障效应.
存在不清洁的流量残留物可能会压倒面膜和设计的保护性好处.

结论:

使用更粗的面膜和铜定义设计可以提高PCB电化学迁移的抗性.
在接后有效地去除流体残留物对于充分实现这些设计选择的好处至关重要.
这些发现为设计更可靠的电子元件提供了实际指导.

关键词:

树突 (dendrites) 是一种树突.电化学迁移的电化学迁移面膜是一种面膜.热湿度偏差测试试验试验水滴测试试验水滴测试试验

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