度和温度对Sn-Bi合金中的溶解和沉的影响
Qichao Hao1, Xinfu Tan1, Qinfen Gu2
1Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia.
Materials (Basel, Switzerland)
|September 14, 2024
概括
(In) 的添加提高了锡-双 (Sn-Bi) 低温合金的热稳定性. 这种合金在热循环过程中增强了微观结构和石分布,提高了用于电子制造的接可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 金工业是金工业的一个方面.
- 固态化学 固态化学
背景情况:
- 低温合金,如锡- (Sn-Bi),对于电子制造来说至关重要,以降低工艺温度.
- 这些合金面临着微观结构不稳定性和在使用温度下由于在锡 (Sn) 中可变的 (Bi) 溶解度而导致的晶格参数变化的挑战.
- 研究的合金添加剂是为了提高Sn-Bi的性能和可靠性.
研究的目的:
- 研究作为合金元素的 (In) 对Sn-Bi合金微观结构和热性能的影响.
- 了解In如何影响热循环期间在锡矩阵内的珠溶解度和分布.
- 评估In的潜力,以提高基于Sn-Bi的合剂的整体可靠性和热稳定性.
主要方法:
- 在现场加热同步粉X射线衍射 (PXRD) 用于研究Sn-57重%Bi-xIn (x = 0,0.2,0.5,1,3重%) 合金.
- 合金经过受控的加热和冷却周期来观察相变和微观结构的演变.
- 微结构分析侧重于在热应力下对珠分布和相位稳定性.
主要成果:
- 发现添加可以修改Sn-Bi合金的微观结构.
- 在热循环过程中观察到在锡阶段内比斯木的更加均的分布,因而增加了IN含量.
- 该研究确定了Bi受In影响的特定溶解和沉行为.
结论:
- 作为Sn-Bi合金中的有益合金元素.
- 此外,它还能提高微观结构的稳定性和更均的Bi分布,从而提高热循环性能.
- 这些发现突出了In的潜力,可以显著提高Sn-Bi低温的可靠性和热稳定性,用于先进的电子应用.
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