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一种模拟方法,用于模拟四层印刷电路板的热稳定状态

Yabin Zhang¹, Lin Chen¹

¹School of Electrical Engineering and Electronic Information, Xihua University, Chengdu, Sichuan, P.R. China.

|September 18, 2024

概括

本研究介绍了印刷电路板 (PCB) 的高效热模拟方法. 该方法结合了分析和数值技术,以准确预测热点温度并降低电阻,提高PCB设计.

科学领域:

电气工程电气工程
热管理热管理
计算建模计算建模

背景情况:

印刷电路板 (PCB) 的热管理对于可靠的电子设备操作至关重要.
识别和减轻PCB过热风险对于防止元件故障至关重要.
现有的模拟方法可能是计算密集的.

研究的目的:

为PCB开发一种高效准确的热模拟方法.
整合电热分析以改善PCB设计.
根据实验数据和商业软件验证拟议的建模方法.

主要方法:

结合了用于预表面的富里埃序列分析解决方案和用于金属层的有限体积方法.
估计了侧向传热,并将核心层视为热厚.
通过代计算将取决于温度的边界条件纳入并开发一个测试解决器.

主要成果:

对四层PCB的COMSOL Multiphysics进行了验证的建模准确性.
通过对3.3V直流生成PCB的热成像确认了模拟结果.
通过布局调整,证明了朱尔加热,红外线下降和热点温度的降低.

结论:

拟议的混合分析-数值方法为PCB热模拟提供了准确和高效的工具.
集成的电热分析有助于优化PCB布局的热性能.
该方法有效地降低了热点温度和红外线下降,提高了PCB的整体可靠性.

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Thermal expansion and Thermal stress: Problem Solving

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San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55 °C.