电化学设备和半导体的晶圆级异质集成用于单体芯片的半导体
Sixing Xu1,2, Fan Xia1,3, Zhangshanhao Li1
1School of Integrated Circuits, Tsinghua University, Beijing 100084, China.
National science review
|September 20, 2024
概括
研究人员开发了一种新的理论,用于将微型电化学设备与半导体集成在一起. 这使得第一个单体整流器-过器芯片的创建成为可能,大大减少了尺寸,并使大规模生产成为可能.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 电化学 电化学 电化学
背景情况:
- 微型电化学设备具有"超过摩尔定律"的潜力,但缺乏半导体集成.
- 目前的局限性阻碍了使用电化学元件构建功能芯片.
研究的目的:
- 为电化学设备和半导体建立一个异质的集成理论.
- 开发一种新的3D集成架构和CMOS兼容的制造方法.
主要方法:
- 提出了电化学封闭效应和材料工作功能匹配标准的建议.
- 开发了一个3D集成架构和CMOS兼容的制造工艺.
- 优化了设备制造,电子/离子隔离,互连和封装.
主要成果:
- 通过将微型超级电容与二极管整流器桥梁电路集成,创建了第一个单体整流器-过器芯片.
- 与非集成商业产品相比,实现了98%的体积减少.
- 证明稳定的输出,波纹系数为0.23%,超过了应用要求.
结论:
- 为电化学设备和半导体建立了第一个异质集成理论.
- 开发了一种CMOS兼容的制造方法,适合大规模生产.
- 在集成电子中为电化学的无处不在应用铺平了道路.
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