电化学设备和半导体的晶圆级异质集成用于单体芯片的半导体

Sixing Xu1,2, Fan Xia1,3, Zhangshanhao Li1

  • 1School of Integrated Circuits, Tsinghua University, Beijing 100084, China.

National science review
|September 20, 2024
PubMed
概括

研究人员开发了一种新的理论,用于将微型电化学设备与半导体集成在一起. 这使得第一个单体整流器-过器芯片的创建成为可能,大大减少了尺寸,并使大规模生产成为可能.

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