陷状态的表征在半在状态应力下的AlGaN/GaNMIS高电子移动性晶体管中
Ye Liang1,2, Jiachen Duan1,2, Ping Zhang2,3
1School of Advanced Technology, Xi'an Jiaotong-Liverpool University, Suzhou 215123, China.
Nanomaterials (Basel, Switzerland)
|September 27, 2024
概括
设备中的半状态应力会导致由于接口陷而导致电流崩. 这项研究确定了0.08 eV的陷能量水平,确认接口陷是增加动态电阻的原因.
科学领域:
- 半导体设备物理学 半导体设备物理
- 材料科学 是一种材料科学.
背景情况:
- 处于半状态应力下的设备表现出显著的电流崩,导致动态电阻增加.
- 了解陷状态对于减轻这种性能下降至关重要.
研究的目的:
- 为了表征陷状态,负责在半在状态应力下设备的电流崩.
- 为了确定界面陷的能量水平和密度.
主要方法:
- 取决于温度的短暂恢复电流分析,以确定陷能量水平.
- 在金属绝缘体半导体 (MIS) 二极管上进行多频电容电压 (C-V) 测试.
主要成果:
- 在半状态应力下,确定了0.08 eV的陷能量水平,表明了接口陷的参与.
- 界面陷密度被计算为1.37×10^13和6.07×10^12cm^-2eV^-1之间的能量水平从EC-ET=0.29 eV到0.45 eV.
结论:
- 接口陷是处于半状态应力状态下的设备中电流崩的主要原因.
- 识别的陷特性为设备设计和可靠性改进提供了洞察力.
关键词:
AlGaN/GaN MIS-HEMTT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN/GaN MIS-HEMT AlGaN/GaN/GaN MIS-HEMT AlGaN/GaN/GaN MIS-HEMT AlGaN/GaN/GaN MIS-HEMT AlGaN/GaN/GaN/GaN/GaN/GaN/GaN/GaN目前的崩正在发生.能源水平 能源水平陷密度 陷密度 陷密度 陷密度陷状态 陷状态 陷状态相关概念视频
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