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微半球共振器通过化学蚀刻进行低损坏的修剪

Zhongzhe Zhou¹, Kun Lu¹, Yan Shi¹

¹College of Intelligence Science and Engineering, National University of Defense Technology, Changsha 410073, China.

|September 28, 2024

概括

化学蚀刻有效地修剪了微半球共振器,减少了频率分裂到1Hz以下. 这种低损坏的方法可以提高陀螺仪的稳定性和可靠性,而不会影响Q因子或表面质量.

科学领域:

微电机系统 (MEMS) 是指微电机系统.
传感器技术传感器技术
材料科学材料科学材料科学

背景情况:

微半球陀螺仪需要精确的频率匹配以获得最佳性能.
减少频率分裂的现有修剪方法往往会导致表面损伤或降低Q因子.
高成本和复杂的修剪过程限制了这些陀螺仪的广泛采用.

研究的目的:

提出和验证一种用于修剪微半球共振器的新型化学蚀刻方法.
为了实现低损坏,高质量的表面修剪,以减少频率分裂.
为提高陀螺仪性能提供一个具有成本效益和易于实施的解决方案.

主要方法:

用于共振器修剪的化学蚀刻过程的理论分析.
模拟以确定最佳修剪参数 (范围和位置).
实验验证该方法对频率分割,Q因子和表面质量的影响.

主要成果:

成功地将微半球共振器的频率分割降低到1Hz以下.
展示了最小的损坏,并保持了高表面质量后修剪.
通过模拟和测试的Q因子分析验证了该方法的低损害特性.

结论:

化学蚀刻是一种可行的,低损坏的技术,用于修剪微半球共振器.
拟议的方法有效地减少了频率分裂,同时保持了共振器的完整性.
这种方法为提高微半球共振器陀螺仪的性能和可靠性提供了显著的潜力.

关键词:

化学蚀刻化学蚀刻化学蚀刻低损坏的修剪,减少损坏.这是一个微型半球.

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