宽频带同轴TSV传输互连的建模和分析
Yujie Zhang1, Changle Zhi1, Gang Dong1
1School of Microelectronics, Xidian University, Xi'an 710000, China.
Micromachines
|September 28, 2024
概括
这项研究验证了同轴透过电路 (CTSV) 互连的同等电路模型. 该模型准确地预测了S参数,这对于先进电子中的高速信号传输至关重要.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 半导体设备物理 半导体设备物理
背景情况:
- 同轴透过通道 (CTSV) 对于先进的半导体包装中的高密度互连至关重要.
- 准确的CTSV互连模拟对于预测信号完整性和性能至关重要.
研究的目的:
- 开发和验证CTSV互连的同等电路模型,包括RDL和颠结构.
- 通过将模拟结果与3D模型进行比较来评估拟议模型的准确性.
主要方法:
- 为 CTSV,RDL 和 bump 组件构建一个 3D 模型.
- 为每个组件提取同等电路模型.
- 3D和同等电路模型之间的S参数提取和比较.
- 参数分析用于评估模型参数对信号传输的影响.
主要成果:
- 相应的电路模型表现出高精度,与3D模型相比,S11的最大误差为0.4%,S21的最大误差为0.18%.
- 相当电路模型的有效性通过一致的S参数结果得到证实.
结论:
- 开发的等效电路模型提供了CTSV互连的有效和准确的表示.
- 该模型适用于分析信号传输特性和在高速电子设计中进行参数研究.
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