晶圆尺度原子层沉积TeO/Te异构P型薄膜晶体管
Pukun Tan1,2, Chang Niu1,2, Zehao Lin1,2
1Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, United States.
Nano letters
|October 1, 2024
概括
原子层沉积的 (Te) 氧化物/Te异构结构提供可扩展的p型半导体解决方案. 这项研究证明了它们在晶圆尺度上的统一性和对先进电子产品的集成兼容性.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 纳米技术纳米技术
背景情况:
- 对于与后端线 (BEOL) 工艺兼容的p型半导体的需求不断增长.
- (Te) 由于其电特性和低温加工潜力而具有前景.
- 目前可扩展的Te集成依赖于物理蒸气沉积.
研究的目的:
- 为了展示晶圆尺度的原子层沉积 (ALD) TeO2/Te异构薄膜晶体管.
- 评估补充金属氧化物半导体 (CMOS) 技术的统一性和集成兼容性.
- 为了研究欧姆接触形成的机制.
主要方法:
- 对于TeO2/Te异构结构的原子层沉积 (ALD).
- 晶圆尺度的制造和表征.
- 空间拉曼光谱和电分析.
- 带对齐分析. 带对齐分析.
主要成果:
- 证明了ALD TeO2/Te薄膜的晶圆尺度统一性.
- 实现了BEOL应用程序的高集成兼容性.
- 由于表面积累和独特的波段对齐,观察到良好的欧姆接触.
- 与n型ALD氧化物半导体成功集成.
结论:
- ALD TeO2/Te是一种可行的p型半导体,用于可扩展的,均的薄膜晶体管.
- 该材料显示出在BEOL CMOS中实现单立体3D集成的绝佳潜力.
- 这些发现为先进的半导体设备制造铺平了道路.
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