离子液体修饰铜用于增强环氧树脂/扩展石墨复合材料的热导电性和机械性能
Yan-Chun Li1, Na Chu2, Fan-Long Jin3
1Department of Chemistry and Pharmaceutical Engineering, Jilin Institute of Chemical Technology, Jilin City 132022, People's Republic of China.
ACS omega
|October 7, 2024
概括
这项研究开发了双A (DGEBA) /扩展石墨 (EG) /铜 (Cu) 复合物用于热接口材料. 添加10重%的Cu显著改善了导热率和机械性能,尽管热稳定性下降了.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物复合材料 聚合物复合材料
- 纳米材料是一种纳米材料.
背景情况:
- 开发先进的热接口材料 (TIM) 对于电子设备的热管理至关重要.
- 基于双甲基 (DGEBA) 的复合材料提供了潜力,但需要增强的导热性.
- 加入像扩展石墨 (EG) 和铜 (Cu) 这样的导热填充剂是改善 TIM 性能的一种常见策略.
研究的目的:
- 为高导热应用准备和描述DGEBA/EG/Cu复合材料.
- 研究铜 (Cu) 含量对复合材料的热,机械和形态性能的影响.
- 评估离子液体表面修饰对铜颗粒的有效性,以改善网络形成.
主要方法:
- 合成双A (DGEBA) /扩展石墨 (EG) /铜 (Cu) 复合物的二甲基乙烯.
- 使用1-乙基-3-甲基伊米达二胺离子液体对Cu粉的表面修改.
- 在DGEBA/EG矩阵中Cu含量的系统变化 (0-10 wt%).
- 热导电性,热稳定性,曲性质,冲击强度和形态 (SEM) 的表征.
主要成果:
- 添加10%重量的使热导率从7.35增加到9.86W/m·K.
- 柔性强度,冲击强度和柔性模量随着Cu含量增加而得到改善.
- 复合材料的热稳定性随着Cu的添加而下降.
- 在SEM分析中,发现碎片表面有微裂的板状块.
结论:
- 作为热接口材料,DGEBA/EG/Cu复合材料具有前景,优化Cu含量可提高热性能和机械性能.
- 对Cu表面的离子液体修饰有助于构建导热网络.
- 存在权衡,因为增加含量会对热稳定性产生负面影响.
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