新型设计和实施3D打包宽带带宽带过器的新设计和实施
Xiexun Zhang1, Tao Tang2, Maged A Aldhaeebi3
1College of Electronic and Information, Southwest Minzu University, Chengdu, Sichuan, 610225, China.
Scientific reports
|October 9, 2024
概括
这项研究通过垂直整合高通 (HPF) 和低通 (LPF) 过器,引入了一种新的3D包装宽带带通波器 (BPF). 这种创新的设计大大减少了尺寸,同时提高了各种频率应用的性能.
科学领域:
- 电气工程 电气工程
- 微波工程 微波工程
- 过器的设计设计
背景情况:
- 传统的过器设计往往面临尺寸和性能方面的限制.
- 整合多种过器类型带来了制造和性能方面的挑战.
研究的目的:
- 开发一款创新的3D打包宽带带通波器 (BPF).
- 通过垂直集成实现显著的尺寸缩小和性能提升.
主要方法:
- 高通波器 (HPF) 和低通波器 (LPF) 的垂直集成使用空气腔和垂直互连接接口 (VIA).
- 使用部分基板集成悬浮线 (SISL) 结构来精确控制介电常数和特征阻抗.
- 理论分析和S参数倒置以确定最佳的空气腔高度.
主要成果:
- 制造的BPF使用2.175至4.2 GHz的传输带运行.
- 实现的插入损失低于2.5dB,返回损失超过10dB.
- 在每个层上展示了独立电路设计,用于3D组装.
结论:
- 拟议的3D集成方法为BPF提供了一个紧而高性能的解决方案.
- 这种方法简化了多频段过器的开发,并且可以扩展到制造.
- 该设计显示了在不同频率范围的多功能性,具有显著的实际好处.
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