理论研究金属互连中对金属传输特性点缺陷的理论研究
Shumin Yan1, Ruiling Gao1, Shunbo Hu1,2
1Physics Department, International Center of Quantum and Molecular Structures, Institute for the Conservation of Cultural Heritage, Materials Genome Institute, Shanghai University, 200444 Shanghai, People's Republic of China.
像空位和碳化等点缺陷会降低金属互连电导率. 碳兴奋剂严重影响Al,Cu和Ag,而空缺更严重影响Ir,Rh和Ru,Rh表现出优越的导电性.
科学领域:
- 材料科学 材料科学 材料科学
- 凝聚物质物理学 凝聚物质物理学
- 计算化学的计算化学
背景情况:
- 金属互连面临性能和可靠性问题,原因是随着线宽的减少,由于缺陷而增加的电子散射.
- 点缺陷,包括空位和间隙原子,显著影响金属中的电子散射.
- 了解缺陷影响对于设计先进电子设备至关重要.
研究的目的:
- 系统地研究点缺陷 (空位和碳杂) 对Al,Cu,Ag,Ir,Rh和Ru的运输特性的影响.
- 为了比较不同类型的缺陷对各种金属连接器的影响.
- 为了确定未来互连的最佳材料和缺陷管理策略.
主要方法:
- 密度函数理论 (DFT) 用于电子结构计算.
- 运输属性模拟的非平衡格林函数 (NEGF) 方法.
- 在选定的金属中对空缺缺陷和间歇性碳兴奋剂的系统分析.
主要成果:
- 所有研究的点缺陷都会由于增强的电子散射而降低金属的导电性.
- 由于强烈的轨道杂交,碳兴奋剂显著降低了Al,Cu和Ag的导电性.
- 空位缺陷对Ir,Rh和Ru导电性有更明显的影响,原因是晶格扭曲和电荷转移.
- (Rh) 在所有研究的系统中都表现出极好的导电性.
结论:
- 避免在 Al,Cu 和 Ag 互连中使用碳兴奋剂,以保持导电性.
- 尽量减少Ir,Rh和Ru互连中的空缺缺陷,以获得更好的性能.
- (Rh) 是下一代金属互连的有希望的候选材料,因为它具有固有的导电性和耐缺陷性.
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