双面抛光中的数值分析:边缘回滚的机制探索
Jiayu Chen1,2,3, Yiran Liu3, Ding Wang1
1School of Materials and Chemistry, University of Shanghai for Science and Technology, Shanghai 200093, China.
Materials (Basel, Switzerland)
|October 16, 2024
概括
这项研究揭示了晶片抛光过程中的应力度如何影响边缘滚动和抛光均性. 了解这些应力机制是提高半导体基材质量和平度的关键.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体制造业 半导体制造业
- 机械工程 机械工程
背景情况:
- 提高半导体晶片质量对于先进的电子产品至关重要.
- 双面抛光 (DSP) 是实现晶圆平面性的关键过程.
- 在DSP过程中压力度对晶片的影响需要进一步了解机制.
研究的目的:
- 研究在晶片抛光过程中应力度的机制.
- 分析接触状态和应力对边缘滚动 (ERO) 和抛光速率均性的影响.
- 为优化DSP流程设计提供基础.
主要方法:
- 用于抛光模拟的二维有限元模型的开发.
- 有限元素模型的实验验证.
- 分析因晶圆厚度和载体间隙而导致的接触状态变化.
主要成果:
- 在抛光过程中确定了六个不同的接触状态阶段.
- 确定在晶圆边缘的板压缩会导致应力度.
- 观察到一个影响 ERO,抛光均性和晶圆平度的门应力值.
结论:
- 应力度是影响DSP期间晶圆平面性的重要因素.
- 晶圆厚度和载体间隙极大地影响接触状态和应力分布.
- 通过管理应力度来优化DSP可以提高半导体基材质量.
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