通过超薄的AlN后壁层改善了基于GaN的双通道HEMT的直流和射频特性
Qian Yu1, Chunzhou Shi1, Ling Yang1
1State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xi'an 710071, China.
Micromachines
|October 26, 2024
概括
高电子移动性晶体管 (GaN HEMT) 显示出优越的性能,而不是亚 (InAlN) 亚屏障HEMT. AlN结构表现出更高的输出电流,故障电压和用于先进电子的功率效率.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电气工程 电气工程
背景情况:
- 双通道化高电子流动性晶体管 (GaN HEMT) 需要优化结构,以改善脱状态和分解特性.
- 超薄屏障层,特别是化 (AlN) 和化 (InAlN) 副屏障,正在作为提高设备性能的潜在候选人进行研究.
研究的目的:
- 为了比较AlGaN/GaN/AlN/GaN (亚-AlN) HEMT和AlGaN/GaN/InAlN/GaN (亚-InAlN) HEMT的性能.
- 确定更适合的子屏障层,以改善双通道GaN HEMT的离位和分解特性.
主要方法:
- 两个类型的HEMT的制造和表征:亚AlN和亚InAlN结构.
- 传输电子显微镜 (TEM) 分析用于研究材料特性.
- 电气性能测试,包括输出电流密度,传导性,故障电压,电流增强切断频率 (fT),最大振荡频率 (fmax),功率增加效率 (PAE) 和输出功率密度 (Pout).
主要成果:
- TEM成像揭示了InAlN屏障中的印分离,对第二通道的移动性产生了负面影响.
- 与sub-InAlN HEMT相比,sub-AlN HEMT显示出更高的输出电流密度 (11.3 W/mm) 和透导率.
- 亚-AlN HEMT 实现了比亚-InAlN HEMT (121 V) 更高的故障电压 (294 V),归因于AlN层屏蔽漏电流. 较高的FT,fmax,PAE (57%) 和Paut也在亚ALN HEMT中观察到.
结论:
- 由于其优越的材料质量和设备性能,AlN子屏障是双通道GaN HEMT更合适的选择.
- 与其亚InAlN对应器相比,亚AlNHEMT提供了增强的输出特性,故障电压,频率响应和功率效率.
- 这些发现凸显了亚网结构在高功率和高频应用中的潜力.
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