二维ZrS2和HfS2用于制造10nm以下高性能P型晶体管
Xuemin Hu1,2, Yu Huang3, Hengze Qu2
1School of Material Engineering, Jinling Institute of Technology, Nanjing 211169, China.
The journal of physical chemistry letters
|October 28, 2024
概括
新的二维 (2D) 过渡金属二甲基化物 (TMDC) 半导体ZrS2和HfS2显示出对高性能P型场效应晶体管 (FET) 的前景. 这些材料使先进的10nm以下的补充金属氧化物半导体 (CMOS) 集成电路成为可能.
科学领域:
- 材料科学 材料科学 材料科学
- 凝聚物质物理学 凝聚物质物理学
- 半导体设备物理 半导体设备物理
背景情况:
- 二维 (2D) 过渡金属二甲基二化物 (TMDC) 对10nm以下的场效应晶体管 (FET) 是有前途的.
- 与N型设备相比,现有的2D P型设备表现较差,阻碍了补充金属氧化物半导体 (CMOS) 开发.
- 对于先进的通道材料来提高P型FET的性能,这是非常需要的.
研究的目的:
- 研究2D ZrS2和HfS2作为高性能P型MOSFET通道材料的潜力.
- 用第一原则模拟来评估它们的电子特性和设备性能.
- 为了证明它们对未来10nm以下集成电路的适用性.
主要方法:
- 采用了第一原则的量子运输模拟.
- 计算了电子带结构和载波有效质量.
- 性能指标,如现状电流 (离子) 和能量延迟产物,对缩放设备进行了模拟.
主要成果:
- ZrS2和HfS2在价值带边缘呈现连续的平面内p轨道,导致一个小孔的有效质量 (0.24 m0).
- 使用ZrS2和HfS2模拟的10纳米长P型MOSFET实现了2000μA/μm的高状态电流 (离子).
- 即使在5nm门长度,离子仍然很高 (∼1500μA/μm) 与竞争力的能量延迟产品.
结论:
- 2D ZrS2和HfS2被确定为下一代P型FET的竞争激烈的通道材料.
- 它们的卓越性能超过了规模化P型设备的MoS2和WSe2等现有的二维材料.
- 这些发现为开发高性能10nm以下CMOS集成电路铺平了道路.
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