穿CRISPR/Cas9

Zixi Li1, Xinyue Su1, Yihong Lin1

  • 1Department of Biomedical Engineering, School of Medical Technology, Beijing Institute of Technology, Beijing 100081, China.

概括

一个新的大容量连续电穿孔芯片 (LaViE-Chip) 实现了CRISPR/Cas9基因治疗的高效,大规模的细胞编辑. 这一突破克服了基因编辑技术广泛临床应用的关键障碍.