基于SOI开关和SAW过器的新型SiP集成射频前端模块的设计
Xuanhe Wei1, Youming Miao1, Xiao Jin1
1College of Electrical and Electronic Engineering, Wenzhou University, Wenzhou 325035, China.
Sensors (Basel, Switzerland)
|November 9, 2024
概括
本研究介绍了一个新的系统包装 (SiP) 架构,集成在绝缘体 (SOI) 开关和表面声波 (SAW) 过器,用于先进的无线系统. 新的设计增强了RF前端模块中的微型化,多功能性和通信可靠性.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 电信工程 电信工程 电信工程
背景情况:
- 新兴的无线技术需要小型化和多功能组件.
- 集成的复杂性是开发先进的射频系统的一个重大挑战.
- 载波聚合 (CA) 技术需要复杂的射频前端架构.
研究的目的:
- 提出一种新的系统包装 (SiP) 集成架构.
- 在芯片中集成在绝缘体 (SOI) 开关和表面声波 (SAW) 过器.
- 解决无线应用的小型化和多功能性要求.
主要方法:
- 开发了一个新的SiP集成架构.
- 在单一芯片上集成SOI开关和SAW过器.
- 优化了CA的架构设计,阻抗匹配和信号完整性.
- 制造了一个Sub-3GHz射频前端多样性接收器模块用于验证.
主要成果:
- 在制造的射频前端模块中实现了高包装密度.
- 证明了增强的通信可靠性.
- 验证了使用SOI开关和SAW过器设计SiP的可行性.
- 成功实现了载体聚合 (CA) 技术.
结论:
- 拟议的SiP架构有效地集成了SOI开关和SAW过器.
- 该设计满足了无线系统中小型化和多功能性的需求.
- 开发的射频前端模块适用于各种微型射频应用.
相关概念视频
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01:23Small-Signal Analysis of MOSFET Amplifiers
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01:20Design Example: Capacitance Multiplier Circuit
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01:25Active Filters
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