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超快激光激光启用三维的光声学特征,微芯片的纳米内部特征的微芯片
Yi He1, Guojie Luo1, Jie Huang1
1Department of Mechanical Engineering The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR, PR China.
Ultrasonics
|November 14, 2024
概括
一种新的超快激光方法使用光声波来非破坏性地成像不透明半导体芯片的3D纳米内部,揭示具有高分辨率的特征.
科学领域:
- 材料科学 材料科学 材料科学
- 纳米技术纳米技术
- 光学是什么?光学是什么?光学是什么?
背景情况:
- 微型制造业的进步需要半导体设备的复杂表征技术.
- 确保半导体设备的质量在很大程度上依赖于准确的材料和结构特性.
- 现有方法在不透明材料中对3D纳米特征进行现场,非破坏性分析方面扎.
研究的目的:
- 开发一种基于激光的超高速光声学方法,用于半导体微芯片的现场表征.
- 为了实现精确的校准和三维 (3-D) 的划定,纳米内部特征.
- 为可视化不透明微芯片内部结构提供一种非破坏性的方法.
主要方法:
- 使用了超快的电子-声波合和速度扰乱的光学干扰原理.
- 配置了一个 femtosecond 激光探头设置,采用 Sagnac 干扰仪.
- 生成并获取皮秒超声波批量波 (P-UBWs) 来探测微芯片内部.
主要成果:
- 内部微芯片具有P-UBW信号中的诱导相位移,通过探头激光扰动检测到.
- 校准的相位移允许计算特征划分的信号相关性.
- 通过描述具有不同深度的纳米金网格进行实验验验证,揭示了几十纳米的深度变化.
结论:
- 开发的光声学方法学成功地揭示了不透明微芯片中的3D纳米特征.
- 在横向和深度方向上分别实现了微观和纳米空间分辨率.
- 为半导体制造业的高分辨率地下成像提供了一种快速,非破坏性的技术.
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