具有前所未有的孔场效应移动性的p型氧化物薄膜晶体管为全氧化物CMOS CFET类逆变器,适合单体3D集成
Jiqing Lu1,2, Mei Shen3, Xuewei Feng4
1Harbin Institute of Technology, Harbin 150001, China.
Nano letters
|November 19, 2024
概括
研究人员开发了一种高性能,低温加工的氧化 (SnO) 薄膜晶体管 (TFT). 这一进步使得基于氧化物的互补金属氧化物半导体 (CMOS) 电路具有高电压增益和低功耗.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电子工程 电子工程
背景情况:
- 高性能,低温可加工的p型氧化物薄膜晶体管 (TFT) 对于在线后端 (BEOL) CMOS电路系统中的单体集成至关重要.
- 现有的p型氧化物TFT通常缺乏先进集成电路所需的性能.
研究的目的:
- 为了展示一种具有增强性能特性的新型反应磁铁喷射SNO TFT.
- 调查材料性能和电气行为之间的相关性,以优化SnO薄膜.
- 通过将开发的SNO TFT与IGZO TFT集成,实现完全基于氧化物的CMOS逆变器.
主要方法:
- 使用反应磁铁子喷射制造SNO TFTs.
- 材料表征技术用于分析SnO薄膜的结构和组成特性.
- 单个TFT和集成CMOS逆变器的电气测试.
- 在沉积和后过程中,通过氧气偏压调节薄膜特性.
主要成果:
- 在SNO TFT中实现了前所未有的387 cm2/V·s的孔场效应移动性 (μh).
- 证明了2.5 × 103的开/关电流比 (离子/关电) 和240.9mV/dec.的下值波动 (SS).
- 成功制造了一种基于氧化物的CMOS逆变器,具有高电压增益 (57) 和低静电功耗 (34pW).
结论:
- SnO TFT 的性能与薄膜的结构和构成相调直接相关.
- 优化 SnO TFT 适合集成到低功耗,高性能氧化物基 CMOS 电路中.
- 这项工作为使用地球上丰富的氧化物材料的电子设备的先进单立体集成铺平了道路.
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