高性能内在伸缩晶体管和集成电路的设计考虑因素和制造协议
Donglai Zhong1, Yuya Nishio2, Can Wu1
1Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States.
ACS nano
|November 20, 2024
概括
研究人员开发了高性能内在可拉伸晶体管和集成电路的协议. 这些进展对于下一代可穿戴和可植入电子设备至关重要.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 生物医学工程 生物医学工程
背景情况:
- 本质上可以拉伸的电子产品对于先进的可穿戴和可植入技术至关重要.
- 软集成电路对于机身上的信号处理和计算是必要的.
- 之前的工作重点是高密度,高性能可拉伸晶体管.
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