基于Hafnia的铁电晶体管与聚Si门,用于第一个门的三维NAND结构
Ik-Jyae Kim1, Jiwoung Choi1, Jang-Sik Lee1
1Department of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea.
ACS applied materials & interfaces
|November 20, 2024
概括
多晶 (poly-Si) 可以替代3D NAND内存的基于哈夫尼亚的铁电晶体管中的常规材料. 这简化了制造,通过启用第一门工艺,减少了制造步骤.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体设备物理 半导体设备物理
背景情况:
- 基于Hafnia的铁电晶体管是高级内存的关键,包括3D NAND.
- 传统的3D NAND使用TiN或W门,需要复杂的门末处理和更换步骤.
研究的目的:
- 在3D NAND中研究多晶 (poly-Si) 作为3D NAND中基于哈夫尼亚的铁电晶体管的门材料.
- 评估使用聚Si门的简化制造工艺的可行性.
主要方法:
- 使用聚Si作为门电极制造基于哈夫尼亚的铁电晶体管.
- 将这些晶体管集成到3D NAND架构中.
- 拟议的第一门流程与传统的最后门方法的比较.
主要成果:
- 证明成功地使用聚Si作为基铁电晶体管的门材料.
- 展示了3D铁电NAND设备的简化Gate-first制造过程.
- 消除了需要取代门的步骤,这是常见的门-最后的过程.
结论:
- 多是一种可行的门材料,用于3D NAND中的基于哈夫尼亚的铁电晶体管.
- 使用聚Si可实现更高效的3D铁电NAND的第一门制造工艺.
- 这种方法为下一代内存设备提供了一个更简单,潜在的更具成本效益的制造路线.
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