Liyu Dai1, Xiaomin Wu1, Yiqing Guo1

  • 1Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Energy and Power Engineering, Tsinghua University, Beijing 100084, China. wuxiaomin@mail.tsinghua.edu.cn.

Lab on a chip
|November 21, 2024
PubMed
概括

这项研究引入了一种用于微流体冷却的新型电毛细管热交换方法. 使用-合金滴滴,它可提高高达110%的散热,提供更简单,更具成本效益的解决方案.