一个全面的微观结构意识的电迁移建模框架;研究大马士革铜互连中沟尺寸的影响
Ahmed Sobhi Saleh1,2, Kristof Croes1, Hajdin Ceric3
1IMEC, Kapeldreef 75, B-3001 Leuven, Belgium.
Nanomaterials (Basel, Switzerland)
|November 26, 2024
概括
这项研究引入了一个模拟框架,以了解纳米互连中的电迁移 (EM),揭示了1:1比例通过促进竹式结构来最大限度地延长设备的寿命,显著提高了可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 计算物理 计算物理
背景情况:
- 收缩的电子设备导致更高的电流密度,加剧电迁移 (EM) 效应.
- 了解EM对于确保纳米互连的可靠性和寿命至关重要.
- 微观结构,包括颗粒大小和接口,显著影响EM行为.
研究的目的:
- 开发一个全面的模拟框架,用于研究纳米互连中的EM.
- 分析微观结构的作用,特别是扩散异质性,在EM.
- 模拟EM的所有阶段,包括压力演变,空心核和空心动力学.
主要方法:
- 一种新的方法,利用实验数据的颗粒大小的统计分布来生成导体金属微结构.
- 通过金属纹理和接口将扩散异质性纳入模拟模型.
- 在纳米互连中模拟原子流量和应力分布.
主要成果:
- 核化正常化时间的近线性增加,在面积比率> 1 的互连宽度增加时,核化时间的正常化时间增加.
- 在宽度增加时,面积比 < 1 的核化时间和.
- 面积比为1最大化了EM寿命,通过培养一种类似竹子的结构,估计与面积比2相比,寿命增加了2倍.
结论:
- 开发的模拟框架准确地预测了EM行为,并通过实验结果进行验证.
- 互连维度,特别是尺寸比,在EM可靠性中起着至关重要的作用.
- 优化互连几何,特别是实现1的比例,是提高电子设备寿命的关键.
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