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Updated: Jun 6, 2025

Mechanoluminescent Visualization of Crack Propagation for Joint Evaluation
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在混合结合接口上使用数值分析评估裂纹形成的风险

Xuan-Bach Le1, Sung-Hoon Choa2

  • 1Graduate School of Nano IT Design Fusion, Seoul National University of Science and Technology, Seoul 01811, Republic of Korea.

Micromachines
|November 27, 2024
PubMed
概括

这项研究表明,退火温度和水对混合粘合的可靠性有很大影响. 优化这些因素,特别是超过200°C的化,对于防止裂形成和确保强大的半导体包装至关重要.

关键词:
化学机械抛光 (CMP) 缺陷形成裂的裂形成.有限元素分析 (FEA)混合型债券是一种混合型债券.剥离压力 剥离压力

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