通过操纵纳米双胞胎方向来调节电 Cu 的残余应力的一项研究
Gangli Yang1, Tailong Shi1, Liu Chang1
1School of Integrated Circuits, Southeast University, Nanjing 211189, China.
Micromachines
|November 27, 2024
概括
研究人员通过控制纳米双胞胎的方向来调节玻璃基板上的电铜 (Cu) 的残余应力. 这种方法解决了芯片包装的关键挑战,防止了高级计算应用中的分层和断裂.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体制造业 半导体制造业
- 纳米技术 纳米技术
背景情况:
- 由于其优良的性能,玻璃基板为切片系统提供了潜在的潜力.
- 在玻璃上的电金属层中的残余应力是主要的瓶,导致分层和破碎.
- 当前的玻璃包装技术需要解决方案来减轻压力引起的故障.
研究的目的:
- 展示一种用于调节玻璃上的电铜残余应力的新方法.
- 为了研究纳米双胞胎定向对残余应激的影响.
- 为提高基于玻璃的异质集成的可靠性提供见解.
主要方法:
- 通过控制电条件 (Cl-度,凝度,速度) 来操纵电铜 (Cu) 中的纳米双胞胎方向.
- 描述不同电参数所产生的纳米双胞胎定向 (非定向,110,111).
- 在回火之前和之后测量Cu层中的残余应力.
主要成果:
- 纳米双胞胎的方向 (非定向,垂直/110,水平/111) 被成功控制.
- 面向111的纳米双胞胎在电后表现出最低的残余应力 (39.7 MPa).
- 化显著降低了残余应力,111-nt-Cu显示最低值 (29.1 MPa) 由于减少的位移密度和最小的再结晶.
结论:
- 控制纳米双胞胎的方向是一种有效的策略,可以调节玻璃上的电Cu中的残余应力.
- 面向111的纳米双联铜在最大限度地减少玻璃包装的残余应力方面提供了卓越的性能.
- 这种方法提高了玻璃基板的可行性,用于高性能晶片集成.
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