基于宽带S参数的多层陶电容器的特征,这些电容器通过在PCB上的曲测试而受到机械应力
Victoria Gutiérrez-Vicente1, Jesús Alejandro Torres-Torres2, Reydezel Torres-Torres1
1Instituto Nacional de Astrofísica, Óptica y Electrónica (INAOE), San Andrés Cholula 72840, Mexico.
Micromachines
|November 27, 2024
概括
机械应力会降解多层陶电容器的性能. 这项研究量化了由于裂造成的射频性能变化,揭示了仅仅降低电容量是微波响应的不足指标.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 物理 物理学 物理
背景情况:
- 多层陶电容 (MLCC) 是重要的电子元件.
- 机械应力可以诱导裂,影响MLCC的性能.
- 量化压力下的射频性能降低对于可靠性至关重要.
研究的目的:
- 通过测量射频响应,充分描述机械应力下的MLCC.
- 量化裂对设备射频性能的影响.
- 在机械测试期间开发一种用于现场射频测量的新型测试装置.
主要方法:
- 使用基于微条纹的测试装置进行矢量网络分析仪测量.
- 在PCB上对MLCC施加机械应力 (曲).
- 关联射频测量与微探测器数据和光学横截面分析.
主要成果:
- 机械应力显著改变了MLCC电容,串联电阻和串联电感.
- 裂形成导致RF性能有量化的退化.
- 如果仅考虑降低电容量,微波响应的高估就会发生.
结论:
- 拟议的微条纹测试装置可以在机械应力下准确地描述MLCC的射频特征.
- 仅仅是容量变化并不能完全代表射频性能下降.
- 这项工作提供了一种方法来评估机械负载下MLCC的可靠性.
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