数字研究关于表面粗和微裂纹对温度下降的热屏障涂层应力分布的影响
Mengqi Yu1, Ningning Liu1,2, Ruifeng Dou1
1School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing, 100083, People's Republic of China.
Heliyon
|November 28, 2024
概括
这项研究模拟了大气等离子喷涂 (APS) 热屏障涂层 (TBC) 中的应力,揭示了接口粗度和裂如何影响应力分布和传播. 统一的接口和更厚的氧化物层加快了裂的生长,影响了TBC的完整性.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 计算建模 计算建模
背景情况:
- 热屏障涂层 (TBC) 对于在高温环境中保护元件至关重要.
- 大气等离子体喷射 (APS) 是用于TBC应用的常见方法.
- 了解TBC中的应力度和裂传播对于预测组件寿命至关重要.
研究的目的:
- 开发一种有限元模型,用于分析具有接口粗度和不均温度场的APS TBC中的应力度.
- 调查TGO/BC接口和TC内部裂纹启动对应力再分配的影响.
- 分析界面裂纹传播及其对TBC内的应激状态的影响.
主要方法:
- 结合接口粗性特征的有限元素建模.
- 包含用于裂分析的解模型.
- 在TGO/BC接口和TC内部模拟裂纹启动.
主要成果:
- 在冷却过程中,接口余应力达到临界值.
- 裂纹传播导致应力再分配,改变应力状态从拉力到压力在TC.
- 较小的温度差异和更厚的TGO层加快了界面裂的传播.
- 统一的TGO/BC接口表现出最快的裂增长.
- 应力再分配在TC中创造了拉力应力度区域,促进了垂直裂纹的启动.
结论:
- 接口粗度和裂纹启动显著影响APS TBC中的应力分布.
- 界面裂纹传播对温度梯度,TGO厚度和界面形态敏感.
- 该模型准确地预测了裂开始地点和应力再分配模式,有助于TBC设计和耐用性评估.
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