具有光子集成电路形状优化的制造意识反向设计
Optics letters
|December 24, 2024
概括
制造意识反向设计 (FAID) 通过整合 lithography 模型来改进光子学设备. 这种方法减少了性能降低,导致制造设备的插入损失较低.
科学领域:
- 光子学 是一个光子学.
- 计算设计的计算设计.
- 纳米制造的纳米制造
背景情况:
- 光子学中的反向设计 (ID) 优化了设备几何,但通常会导致对制造缺陷敏感的设计.
- 制造过程中的工艺变化,例如深紫外线 (DUV) 和电子束光刻 (EBL) 的变化,显著降低了设备的性能.
研究的目的:
- 开发一种具有制造意识的反向设计 (FAID) 方法,以考虑石版制作过程的变化.
- 为了提高使用逆向设计设计的光子设备的性能和可制造性.
主要方法:
- 在反向设计优化工作流程中为DUV和EBL集成的光刻模型.
- 使用FAID方法生成和制造了一个Y分支合器和一个亚波长格子 (SWG) 到条形转换器.
主要成果:
- FAID成功生成了可以弥补预测过程偏差的设备.
- 使用FAID制造的设备显示,与传统ID相比,每个设备的插入损失高达0.7dB,较为低.
结论:
- 制造意识的反向设计是一个可行的策略,以减轻可扩展的光子制造中的性能退化.
- FAID 工作流程可以创建强大的光子设备,这些设备能够抵御制造变化.
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