与p型铜的散射效应相关的低频噪声 ((I) 氧化物薄膜晶体管
Jaewook Yoo1, Seohyeon Park1, Hongseung Lee1
1Department of Electronic Engineering, Jeonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju 54896, Republic of Korea.
ACS applied materials & interfaces
|December 31, 2024
概括
铜 (I) 氧化物 (Cu2O) 薄膜晶体管 (TFT) 中的低频噪声主要是由通道电阻引起的. 减少通道厚度显著影响噪声,为开发更好的氧化物半导体提供了洞察力.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电子 电子 电子 电子 电子 电子 电子
背景情况:
- 低频噪声 (LFN) 和1/f噪声是薄膜晶体管 (TFT) 中的关键性能指标.
- 了解像Cu2O这样新兴的氧化物半导体中的噪声来源对于设备优化至关重要.
- 通道阻力和厚度是影响TFT性能和噪声的已知因素.
研究的目的:
- 调查Cu2O TFTs中低频噪声 (LFN) 和1/f噪声的主要来源.
- 为了确定通道厚度 (t_ch) 和噪声特征之间的关系.
- 阐明通道电阻 (R_ch) 和接触电阻 (R_C) 对噪声的贡献.
主要方法:
- 静态直流 (DC) 的I-V表征Cu2O TFTs. 静态直流 (DC) 的I-V表征.
- 使用等离子增强原子层沉积 (PEALD) 制造具有不同通道厚度的TFT.
- 使用Hooge移动性波动 (HMF) 模型分析噪声行为.
主要成果:
- 道阻力 (R_ch) 显著导致移动性降低和1/f噪声.
- 库伦和声子散射都随着通道厚度 (t_ch) 的下降而增加,影响1/f噪声.
- 接触电阻 (R_C) 取决于通道厚度 (t_ch),并且对1 / f噪声的贡献小于R_ch.
结论:
- 频道厚度 (t_ch) 被确定为Cu2O TFT 中的主要噪声源.
- 优化t_ch对于减轻噪声和提高Cu2O TFT性能至关重要.
- 这些发现为开发高性能Cu2O TFT和p型氧化物半导体提供了指导方针.
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