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相关概念视频

Design Example: Capacitance Multiplier Circuit01:20

Design Example: Capacitance Multiplier Circuit

692
In integrated circuit technology, a capacitance multiplier is often utilized to produce a larger capacitance value when a small physical capacitance falls short. This is achieved by a circuit that multiplies capacitance values by a factor of up to 1000, such that a 10-pF capacitor can replicate the performance of a 100-nF capacitor.
The circuit illustrated in Figure 1 below incorporates two op-amps, with the first operating as a voltage follower and the second acting as an inverting amplifier.
692

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Updated: Jun 4, 2025

Knowledge Based Cloud FE Simulation of Sheet Metal Forming Processes
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基于透理论的KMC模拟用于缩放的Fe-FET基于多位内存计算,具有温度补偿策略.

Qingxiao Zhu1,2, Lihua Xu1,2, Zhidao Zhou1,2

  • 1State Key Lab of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, People's Republic of China.

Nanotechnology
|January 2, 2025
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概括

本研究探讨了透传输如何影响铁电场效应晶体管 (FeFET) 多值存储. 降低尺寸比提高了FeFET偏振,减少了设备变异,并增强了可靠计算的状态分离.

关键词:
在 FeFET 收费.从设备到设备的变化变化.多层细胞 (MLC) 是一种多层细胞.透的透是一种透.

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Last Updated: Jun 4, 2025

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科学领域:

  • 材料科学 材料科学 材料科学
  • 电气工程 电气工程
  • 计算物理 计算物理

背景情况:

  • 铁电场效应晶体管 (FeFET) 对多值存储具有前景.
  • 透传输机制显著影响FeFET的性能.
  • 设备对设备的变化和状态重叠是多位应用程序的关键挑战.

研究的目的:

  • 调查透运输对FeFET多值存储的影响.
  • 分析面积比率和温度对FeFET特性的影响.
  • 为基于FeFET的内存计算中的可靠性问题提出解决方案.

主要方法:

  • 动力蒙特卡洛 (KMC) 模拟被用于模拟透运输.
  • 系统地研究了尺寸比率和温度依赖性.
  • 使用高温表征来分析无形通道障碍的影响.

主要成果:

  • 降低设备尺寸比提高铁电极化,减轻变化和改善状态分离.
  • 形态通道障碍,加上多域动态,影响透传输.
  • KMC模拟预测了从300K到400K的多值分布.

结论:

  • 透运输在FeFET多价值存储可靠性中起着至关重要的作用.
  • 设备设计 (面积比) 和材料特性 (通道障碍) 影响性能.
  • 一个高效的写入验证方案可以减轻状态重叠,以改善多位计算.