结合温度对AZ31/Zn/Sn/5083扩散关节微观结构和机械性能的影响
Tianbao Tan1, Yangyang Guo2, Gang Chen1
1Key Laboratory of Advanced Technologies of Materials, Ministry of Education China, School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, China.
Materials (Basel, Switzerland)
|January 8, 2025
概括
这项研究将Mg/Al合金的固态和瞬态液相 (TLP) 扩散结合结合在一起,使用Zn/Sn中间层. 它可以在没有层间预制的情况下实现低温粘合,优化不同合金的连接.
科学领域:
- 材料科学 材料科学 材料科学
- 金工业是金工业的一个方面.
- 连接技术 连接技术
背景情况:
- 扩散粘合对于Mg/Al不同合金接头是有效的.
- 同时在低温下粘合中间层和合金是具有挑战性的.
- 预制中间层增加了扩散结合过程的复杂性.
研究的目的:
- 在相同的参数下实现Mg/Al不同合金的低温扩散结合.
- 为了消除在Mg/Al扩散粘合中需要介层预制的需要.
- 为了研究固态和瞬态液相 (TLP) 扩散粘合与Zn/Sn复合物中间层的联合使用.
主要方法:
- Mg/Al合金的结合固态和TLP扩散结合.
- 使用了一种Zn/Sn复合物中间层,利用Zn-Sn欧性液相形成.
- 在粘合过程中观察到Sn层的完全化和挤出.
主要成果:
- 不同的Mg/Al合金在低温下成功结合,通过Zn/Sn中间层实现.
- Mg/Zn接口通过固态扩散结合;Al/Zn接口通过TLP扩散结合.
- 发现了狭窄的结合温度范围,对关节微观结构产生了重大影响.
结论:
- Zn/Sn复合物中间层通过形成一个短暂的液相,使Mg/Al扩散结合无需预制.
- 该过程允许在相同的参数下在Mg/Zn和Al/Zn接口同时结合.
- 优化结合温度对于控制产生的Mg/Al连接的微观结构和特性至关重要.
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