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在IGBT中对接材料的热应力分析的模拟和评估
Yang Yang1, Jibing Chen1, Bowen Liu1
1School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan 420023, China.
Micromachines
|January 8, 2025
概括
绝缘门双极晶体管 (IGBT) 容易因热和机械应力而发生故障. 模拟分析显示,纳米金提供了卓越的性能,提高了IGBT模块的可靠性和操作员的安全性.
科学领域:
- 电力电子 电力电子 电力电子
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
背景情况:
- 绝缘门双极晶体管 (IGBTs) 是关键功率半导体设备,在苛刻的操作条件下易受热和机械应力的影响.
- 在IGBT模块中散热的增加加快了降解速度,导致潜在的故障和安全风险.
研究的目的:
- 用模拟来预测IGBT模块内的接材料的温度分布,应力和应变.
- 在操作条件下分析接材料中的热力学相互作用.
- 评估和比较用于IGBT模块应用的不同材料的性能.
主要方法:
- 使用ANSYS工作台进行IGBT模块的详细模拟分析.
- 模拟的温度分布,等效应力和材料的等效应变.
- 研究了接材料特性和缺陷位置对模块性能的影响.
主要成果:
- 在稳定状态条件下,IGBT模块的最高连接温度位于芯片的中心.
- 与其他四种合剂相比,纳米金在温度,等效应力和应变方面表现优越.
- 模块边缘和角落附近的缺陷显著增加了应变,并对性能产生了负面影响,裂显示的有害影响小于通过裂.
结论:
- 模拟分析准确地预测IGBT模块的热力学行为,有助于材料选择.
- 纳米金是提高IGBT模块可靠性和安全性的有希望的材料.
- 了解缺陷的影响对于优化接材料设计和改善整体模块完整性至关重要.
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