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Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

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San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in...
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Fused Filament Fabrication FFF of Metal-Ceramic Components
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用几何校正模型开发一种稳定的工艺,用于将线材嵌入合线材制造印刷中,使用几何校正模型.

Valentin Wilhelm Mauersberger1, Fabian Ziervogel1, Linda Weisheit1

  • 1Fraunhofer Institute for Machine Tools and Forming Technology IWU, Nöthnitzer Straße 44, 01187 Dresden, Germany.

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|January 11, 2025
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概括
此摘要是机器生成的。

本研究引入了一种几何校正模型,以提高合丝制造 (FFF) 中的线材沉积精度. 该模型改进了聚合物部件中集成的电气结构的导电线的定位.

关键词:
通过3D打印打印3D打印.添加剂制造 添加剂制造 添加剂制造复合材料 复合材料 是一种复合材料.导电结构是一种导电结构.嵌入式电子 嵌入式电子功能化的功能化.化丝制造工艺 化丝制造工艺电线沉积是电线沉积的过程.电线集成线路集成电线封装添加剂制造 添加剂制造

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科学领域:

  • 增材制造 增材制造 增材制造
  • 材料科学 材料科学 材料科学
  • 电气工程 电气工程

背景情况:

  • 化丝制造 (FFF) 可以通过直接处理电线来整合电气结构.
  • 当前的FFF线条沉积在曲线段中缺乏精度,限制了复杂的电气元件的集成.
  • 开发精确的电线放置方法对于先进的3D打印电子产品至关重要.

研究的目的:

  • 开发和验证一个几何校正模型,以提高FFF中的电线沉积精度.
  • 优化工艺参数,以实现稳定高效的线材集成.
  • 评估对不同线材和聚合物材料的校正模型的一般有效性.

主要方法:

  • 使用了一种具有额外旋转轴和线材料的新型工具头.
  • 创建了一个几何校正模型,转换为G-code,并应用于曲线印刷路径.
  • 打印的弧形被视觉评估为线位和嵌入质量.
  • 过程参数 (挤出系数,料) 和材料 (铜,恒定,PLA,PETG) 系统地变化.

主要成果:

  • 几何校正模型显著提高了0.2毫米线的定位精度在曲的截面.
  • 为了增强电线嵌入,确定了最佳的冷却时间.
  • 多样化的工艺参数和材料证明了该模型的普遍适用性.
  • 确定了特定的参数集,以实现高质量的电线嵌入和定位.

结论:

  • 开发的几何校正模型有效地解决了在FFF中不准确的电线沉积的挑战.
  • 这一进步有利于可靠地将电气功能集成到3D打印的聚合物零件中.
  • 进一步优化工艺参数可以导致电子元件的强大和高效的增材制造.