基于内置可靠性预测的实时监控方法和电路
Wenke Ren1, Yanning Chen2, Xiaoming Li1
1School of Microelectronics, Xidian University, Xi'an 710071, China.
Micromachines
|January 25, 2025
概括
这项研究引入了新的芯片上电路,用于预测芯片上系统故障. 这些电路提供实时监控和早期警告,以对时间依赖的介电断裂,负偏差温度不稳定性和热载体注入进行预警.
科学领域:
- 半导体设备物理学 半导体设备物理
- 集成电路可靠性 集成电路可靠性
- 电子系统工程 电子系统工程
背景情况:
- 芯片故障受到电压,温度和应力持续时间等各种工作条件的影响,导致不可预测的故障时间和机制.
- 操作环境的变化导致类似的芯片表现出不同的故障模式,使可靠性评估复杂化.
研究的目的:
- 提出新的集成电路,用于实时预测系统芯片 (SoC) 可靠性故障.
- 直接在SoC中实现早期预警信号和故障机制的准确诊断.
主要方法:
- 开发了三种专门的预测电路:依赖时间的介电分解 (TDDB) 预测,负偏差温度不稳定性 (NBTI) 预测和热载体注入 (HCI) 预测电路.
- 将这些紧且节能的电路作为IP核心嵌入到主要SoC中,用于共同工作环境监控.
主要成果:
- 拟议的电路允许实时预测故障和可靠性机制诊断.
- 这些嵌入式电路提供早期预警信号,减轻SoC意外故障.
- 该方法允许准确识别故障机制并预测故障时间.
结论:
- 集成可靠性故障预测单元在SoC可靠性的传统方法上提供了显著的进步.
- 这种实时的芯片上监控系统提高了芯片的寿命和操作完整性.
- 紧且节能的设计可轻松地与现代SoC无集成.
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