使用双门偏差触发的第三象限特征对载SiC MOSFET的无传感器连接点温度估计
Yansong Lu1, Yijun Ding1, Jia Li1
1School of Mechanical and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
Sensors (Basel, Switzerland)
|January 25, 2025
概括
本研究提出了一种具有成本效益,无传感器的方法,用于监测电动汽车中的碳化 (SiC) MOSFET温度. 该技术使用现有的硬件和双门偏差来准确估计结点温度,提高热安全.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 电力电子 电力电子 电力电子
背景情况:
- 碳化 (SiC) MOSFET对于电动汽车 (EV) 引逆变器至关重要,需要强大的热管理.
- 目前用于监测SiC MOSFET温度的方法通常需要额外的电路,增加成本和复杂性.
- 对于SiC MOSFETs来说,需要具有成本效益的,无传感器的热监测解决方案.
研究的目的:
- 提出一种新的,高效的,数据表驱动的方法,用于无传感器估计SiC MOSFET连接温度.
- 为了能够在没有额外的硬件的情况下进行准确的热监测,解决现有技术的局限性.
- 提高热管理在电动汽车动力电子产品中的成本效益和适用性.
主要方法:
- 利用SiC MOSFET的第三象限特征和双门偏差 (DGB) 策略来控制反导.
- 引入一个对温度敏感电参数 (TSEPs) 敏感的 MOSFET 工作电流,用于提高精度的双参数函数.
- 采用双阶段电流脉冲来隔离运动效应,并动态构建TSEP组合温度函数.
主要成果:
- 拟议的方法通过使用总线电压和电流测量来实现无传感器交叉点温度估计.
- 通过SPICE模拟和三相逆变器测试台验证的有效性.
- 证明了平均相对估计误差低于7.2%的温度.
结论:
- 开发的数据表驱动方法为无传感器SiC MOSFET热监测提供了准确且具有成本效益的解决方案.
- 双门偏差策略和TSEP当前的功能集成克服了传统方法的局限性.
- 这种技术提高了电动汽车引逆变器的热安全性和可靠性.
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