通过铁电诱导电流调制的非挥发性重配置晶体管
Daniele Nazzari1, Lukas Wind1, Masiar Sistani1
1Institute of Solid State Electronics, Technische Universität Wien, Gußhausstraße 25-25a, 1040 Vienna, Austria.
ACS applied materials & interfaces
|February 6, 2025
概括
新的可重新配置的场效应晶体管 (RFET) 与铁电氧化物 (HZO) 集成,使逻辑内存 (LiM) 硬件成为可能. 这项创新支持低功耗人工神经网络 (ANN) 执行,并嵌入了自学功能.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体设备物理 半导体设备物理
- 计算机工程 计算机工程
背景情况:
- 逻辑内存 (LiM) 架构承诺节能执行人工神经网络 (ANN) 等自我学习算法.
- 可重新配置的场效应晶体管 (RFET) 提供了多功能,运行时可重新配置的逻辑,非常适合高级计算.
- 将内存元素集成到RFET中对于开发具有嵌入式学习的LiM硬件至关重要.
研究的目的:
- 为了研究铁电哈夫氧化 (HZO) 与双顶门RFET的集成.
- 为了证明HZO能够调节Schottky屏障高度并控制RFET中的载体注入.
- 探索基于HZO的RFET作为非挥发性LiM硬件的构建块的潜力.
主要方法:
- 制造具有铁电Hf0.5Zr0.5O2 (HZO) 层的双顶门RFET.
- 电气表征分析HZO极化对肖特基屏障高度和载体运输的影响.
- 使用偏振脉冲高度调节晶体管工作模式 (p型到n型) 和电流水平.
主要成果:
- 成功地将HZO集成到双顶门RFET中.
- 证明HZO极化有效调整Schottky屏障高度,影响载体注入.
- 在p型和n型运输之间实现切换,调制强度取决于偏振脉冲高度.
- 由于HZO极化稳定性,表现出各种设备状态的良好保留.
结论:
- 铁电HZO可以调节RFET设备中跨过Schottky屏障的载体注入.
- 这种HZO-RFET方法可以实现非易失性逻辑内存硬件.
- 开发的设备作为设计用于ANN执行的低功耗电路的理想构件.
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