展示NiCo作为用于Post-Cu互连连接的替代金属
Ju Young Sung1, Gi-Young Jo2, Sang Mo Moon1
1Department of Energy Systems Research and Department of Physics, Ajou University, Gyeonggi-do 16499, Republic of Korea.
ACS nano
|February 12, 2025
概括
单相六角密封- (NiCo) 合金薄膜表现出降低电阻尺寸效应,性能优于8nm以下的铜互连. 这一突破使得微电子中的高级高密度集成成为可能.
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 微电子工程 微电子工程
背景情况:
- 铜 (Cu) 是标准的互连材料,但由于电子散射,其电阻在小尺寸时会增加.
- 这种尺寸效应限制了先进电子设备中的高密度集成.
- 存在需要替代互连材料,以提高纳米尺寸的性能.
研究的目的:
- 调查单相六角密封 (HCP) - (NiCo) 合金薄膜作为铜互连的潜在替代品.
- 为了评估HCP NiCo薄膜的电阻尺寸效应和制造优势.
- 为了克服日益增长的单相HCP NiCo膜的挑战.
主要方法:
- 尼科合金的薄膜沉积.
- 第一个原理计算来预测材料特性 (电阻,电子平均自由路径).
- 薄膜结构,相位和电阻的表征.
- 评估干蚀刻过程和热稳定性.
主要成果:
- 与铜相比,单相HCP NiCo薄膜表现出显著降低的电阻尺寸效应,性能优于8nm厚度以下的Cu.
- 第一原则计算证实了HCP NiCo的较低散体电阻-电子平均自由路径产物.
- 通过使用HCP Co种子层,实现了单相HCP NiCo的成功生长.
- 尼科薄膜具有优越的干蚀性和高热稳定性 (>500°C).
结论:
- HCP NiCo合金薄膜是铜互连的有希望的替代品,克服了当前的缩放限制.
- 降低电阻尺寸效应和制造优势使NiCo适合高密度集成.
- 这项研究为下一代微电子设备铺平了道路.
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