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Updated: May 25, 2025

A Method for Studying the Temperature Dependence of Dynamic Fracture and Fragmentation
09:12

A Method for Studying the Temperature Dependence of Dynamic Fracture and Fragmentation

Published on: June 28, 2015

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在微芯片中发现的热变化对双材料接口 (聚胺-EMC,聚胺-SiO和-EMC) 疲劳和断裂的影响

Pedro F C Videira1, Renato A Ferreira1, Payam Maleki2

  • 1Department of Mechanical Engineering, Faculty of Engineering (FEUP), University of Porto, Dr. Roberto Frias Street, 4200-465 Porto, Portugal.

Polymers
|February 26, 2025
PubMed
概括

温度显著影响半导体包装接口的断裂行为. 了解这些热效应对于提高集成电路设备的可靠性和设计至关重要.

关键词:
这是一个双材料接口接口.脱层是分层的方法.环氧成型化合物 环氧成型化合物疲劳 疲劳 疲劳 疲劳 疲劳 疲劳骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折,骨折.聚胺聚胺的使用方法半导体 半导体 半导体是一种.

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