概括
我们开发了一种新的光纤到芯片边缘合器 (EC),尽管制造尺寸有限,但实现了高合效率. 这种极化不敏感的EC提供了低损耗,克服了集成光子系统目前的制造限制.
科学领域:
- 光子学和集成光学技术.
- 纳米制造的纳米制造
- 光学工程是指光学工程.
背景情况:
- 纤维到芯片边缘合器 (EC) 对于集成光子电路至关重要.
- 目前的EC设计需要小尺寸的特征来实现高合效率,由于石版的限制,这给制造带来了挑战.
- 现有的方法难以平衡合效率与制造可行性.
研究的目的:
- 提出和演示一种新的低损耗,极化不敏感的边缘合器 (EC).
- 为了克服集成光子设备的特征尺寸的制造限制.
- 为了实现高效的合与宽松的制造公差.
主要方法:
- 开发了一种双层的形结构,尖端极其微小.
- 整合一个浅刻的倾斜的缩在一个完全刻的反向的缩.
- 对拟议的边缘合器设计进行实验验证.
主要成果:
- 模拟的合损失为TE的0.53至0.57dB,TM偏振的0.45至0.55dB.
- 试验的最小合损失约为0.54dB.
- 达到极化依赖的损失低至0.18dB.
- 证明了超大的覆盖层制造容忍度.
结论:
- 拟议的双层形EC克服了高效光纤与芯片合的石版制造的局限性.
- 该设计提供了低损失和极化不敏感性,这对于集成光子学至关重要.
- 这种耐制造的方法对各种芯片上的光子应用具有前景.
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