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一个全合一的测试芯片,用于同时测量多个热电参数的多聚中

Lei Shi^1,2, Na Zhou^2,3, Jintao Wu^1,2

¹Key Laboratory of Micro/Nano Devices and Systems, North University of China, Ministry of Education, Taiyuan 030051, China.

|March 6, 2025

概括

这项研究引入了一种新型测试芯片,用于同时测量多晶.

科学领域:

材料科学与工程材料科学与工程
纳米技术纳米技术
固态物理固态物理

背景情况:

聚是传感器的关键热电材料,因为它具有CMOS兼容性和化能力.
精确测量热电参数 (Seebeck系数,导热率,电阻) 对于设备设计至关重要.
现有的方法可能无法在各种兴奋剂水平上同时提供全面的特征.

研究的目的:

开发一个集成的测试芯片,用于同时测量多的热电特性.
为了能够在各种多条件下准确地描述多.
为提供适用于其他热电材料的多功能方法.

主要方法:

在悬浮膜上制造一个具有双层热电结构的全合一测试芯片.
在芯片结构中,多晶作为至少一个热电层的利用.
应用差分计算方法与热成像相结合,用于同时提取参数.

主要成果:

成功地同时测量了电阻,西贝克系数和多的导热率.
在各种兴奋剂条件下证明了对多的特性.
对准确确定热电参数的拟议方法的验证.

结论:

开发的测试芯片能够高效,准确地同时描述多的热电特性.
这种方法促进了高性能热传感器的设计和制造.
这种方法可以适应其他热电材料的表征,从而推进热电设备的优化.

关键词:

塞贝克系数是什么意思一个全合一的测试芯片.多晶是一种多晶.导热率导热率导热率导热率导热率导热率热电参数热电参数

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