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Updated: May 19, 2026

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BEOL设计因素对翻转芯片芯片规模包装的热可靠性的影响

Dejian Li1,2, Bofu Li1, Shunfeng Han1

  • 1Beijing Smart-Chip Microelectronics Technology Company Limited, Beijing 100089, China.

Micromachines
|March 6, 2025
PubMed
概括

芯片包互动 (CPI) 可以导致集成电路的可靠性问题. 这项研究发现,减少环氧成型化合物厚度和CTE填充不足,同时增加聚胺开口,可以减轻线路后端 (BEOL) 结构的裂纹风险.

关键词:
后端线路可靠性的可靠性芯片包互动的交互方式翻转芯片芯片规模的包装低K裂纹的低K裂纹热应力是一种热应力.

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Thermal Stress01:09

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...