在温度循环和随机振动下对复杂PCB组件的可靠性分析
Wenchao Tian1,2, Feiyang Li1, Mang He3
1School of Electro-Mechanical Engineering, Xidian University, Xi'an 710000, China.
Micromachines
|March 6, 2025
概括
这项研究表明,接材料的选择在振动和温度循环下显著影响PCB组件的可靠性. Sn63Pb37在抗振动方面表现出色,而SAC305在热疲劳方面表现更好,影响了部件寿命.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 可靠性工程可靠性工程
背景情况:
- 印刷电路板 (PCB) 组件因随机振动和温度循环而面临故障.
- 了解接关节的可靠性对于电子元件的寿命至关重要.
- 现有的研究往往侧重于单一的环境压力,而不是综合影响.
研究的目的:
- 评估复杂的PCB组件在随机振动和温度循环应力下的可靠性.
- 调查钢筋方法和接关节形态对组装故障的影响.
- 通过实验数据验证有限元模拟模型,以预测故障.
主要方法:
- 使用有限元模拟和环境测试的组合.
- 用损坏模型的线性积累用于故障预测.
- 分析了不同强化技术 (例如,底部填充,角固定) 和子直径的影响.
- 将SAC305和Sn63Pb37合金的性能进行比较.
主要成果:
- 与Sn63Pb37.7相比,SAC305接在温度循环疲劳方面表现优越,与Sn63Pb37.5接相比,在温度循环疲劳方面表现优越.
- 在随机振动疲劳下,Sn63Pb37接表现出明显更高的强度.
- 强化方法,如底部填充和角固定,大大改变了疲劳寿命,温度循环与振动的结果各不相同.
- 增加子直径可以提高随机振动寿命,但可以降低温度循环寿命.
结论:
- 合金的选择 (SAC305与Sn63Pb37) 严重影响PCB组件的可靠性基于主导应力类型.
- 具体的强化策略可以显著改善或降低疲劳寿命,这取决于环境压力.
- 经过测试验证的有限元分析准确地预测了易受接头位置和整体组件故障.
- 合物形态和强化方面的设计选择对于优化PCB在恶劣环境中的可靠性至关重要.
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