一个3.3kV的SiC半超连接MOSFET与沟侧墙植入
Marco Boccarossa1,2, Kyrylo Melnyk1, Arne Benjamin Renz1
1School of Engineering, University of Warwick, Coventry CV4 7AL, UK.
Micromachines
|March 6, 2025
概括
本研究介绍了碳化物 (SiC) MOSFETs的简化半超连接 (SSJ) 设计,提高了性能,减少了高压应用的制造复杂性.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 碳化 (SiC) 金属氧化物半导体场效应晶体管 (MOSFET) 对于高压功率电子 (>3 kV) 非常重要.
- 传统的超连接 (SJ) 技术面临着制造复杂性的挑战.
- 需要改进的SiC MOSFET设计,以平衡高性能与更轻松的制造.
研究的目的:
- 分析一个可行且易于制造的半超联接 (SSJ) 设计,用于3.3kV的SiC MOSFET.
- 为了研究p型侧墙对电荷平衡和设备性能的影响.
- 为了比较平面门 (PSSJ) 和沟门 (TSSJ) SSJ设计与传统平面 MOSFET 的性能.
主要方法:
- 使用技术计算机辅助设计 (TCAD) 模拟.
- 采用沟蚀刻和侧墙植入,使用倾斜的沟改进制造.
- 模拟了平面门 (PSSJ) 和沟门 (TSSJ) 的配置.
主要成果:
- 平面门SSJ (PSSJ) 设计显示故障电压 (BV) 增加了2.5%,现状电阻 (RDS-ON) 减少了48.7%.
- 与传统设备相比,沟门SSJ (TSSJ) 设计实现了BV的3.1%改善和RDS-ON的64.8%减少.
- 倾斜沟SSJ方法显示了显著的性能提升和简化制造.
结论:
- 拟议的倾斜沟SSJ设计为高性能SiC MOSFET提供了可行的解决方案.
- 这种方法有效地提高了故障电压,并降低了状态电阻.
- SSJ设计简化了制造,可能降低了高压功率电子设备的成本.
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