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在热迁移过程中,无电 Ni-P/Sn2.5Ag0.7Cu0.1RE 微关节的微结构和特性

Ruiqing Hou¹, Keke Zhang^2,3, Wenjia Zhao¹

¹School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471000, China.

Scientific reports

|March 12, 2025

概括

无电气Ni-P/Sn2.5Ag0.7Cu0.1RE微关节在温度梯度下表现出不对称的金属间化合物 (IMC) 增长. 这导致骨折位置的转移,以及从柔性骨折转变为脆性骨折,从而减少剪切力.

科学领域:

材料科学材料科学材料科学
金工业是金工业的一个方面.
表面工程是什么?表面工程是什么?

背景情况:

无电 (Ni-P) 涂层对于制造微型接头至关重要.
了解Ni-P/Sn-Ag-Cu微关节在热应力下的行为对于电子可靠性至关重要.

研究的目的:

在温度梯度下研究无电Ni-P/Sn2.5Ag0.7Cu0.1RE微关节的微结构和特性.
分析热迁移对金属间化合物 (IMC) 形成和微关节内的演变的影响.

主要方法:

在铜基板上制造Ni-P层,使用无电.
在温度梯度 (550°C/cm) 下研究微关节微观结构和特性.
在60小时的热应力后,对剪切断裂行为和力量的分析.

主要成果:

在热端和冷端观察到 (Ni,Cu) 3Sn4 IMC 和 Ni-P 层演变的不对称增长.
Ni-P 层通过两个阶段进化:Ni-P → Ni3P + Ni 和 Ni3P + Sn → Ni-Sn-P.
断裂转移到Ni-Sn-P/IMC连接处,从柔性转变为脆性模式,剪切力减少21.8%.

结论:

温度梯度显著影响Ni-P/Sn-Ag-Cu微关节的结构演变和机械性能.
观察到的断裂模式和位置的转变凸显了在热循环下潜在的可靠性问题.

关键词:

没有电的NiPP.骨折骨折骨折骨折是一种接口微观结构的接口.微接接头是微接接头.热迁移是一种热迁移.

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