在造碳纳米管晶体管中克服环境漂移和负偏差温度不稳定性
Andrew C Yu1, Tathagata Srimani2,3, Max M Shulaker1,4
1Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
ACS applied materials & interfaces
|March 18, 2025
概括
化封装增强了碳纳米管场效应晶体管 (CNFET) 的空气稳定性. 交流脉冲操作显著提高了CNFETs对负偏差温度不稳定性的可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 纳米技术纳米技术
背景情况:
- 碳纳米管场效应晶体管 (CNFETs) 在后端逻辑集成中提供了持续电子扩展的途径.
- 在实际应用中,CNFETs的环境漂移 (空气稳定性) 和可靠性仍然是未被充分研究的挑战.
研究的目的:
- 研究改善CNFETs空气稳定性和可靠性的方法.
- 在各种压力条件下的稳定CNFETs的负偏差温度不稳定性 (NBTI) 的特征.
主要方法:
- 化封装用于减轻环境大气引起的门电压变化.
- 为了评估NBTI在不同的电场,温度,门氧化物厚度和应力频率上,CNFET受到DC和AC应力.
主要成果:
- 化封装在90天内将中位值电压变化降低了约8倍,提高了环境稳定性.
- 与直流运行相比,交流脉冲运行,特别是在20%的工作周期和10MHz时,大大提高了CNFET NBTI电阻,在125°C和-1.2V门偏差下,ΔVT 承受力≤100mV的故障时间延长了10^4倍以上.
结论:
- 化封装是克服CNFET中环境漂移的有效策略.
- 交流脉冲操作对于提高CNFET的NBTI可靠性至关重要,为其集成到先进电子系统铺平了道路.
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