高温下 GaN 肖特基二极管的电热故障物理 高温下向前偏差
Nahid Sultan Al-Mamun1, Yuxin Du2, Jianan Song2
1Department of Mechanical Engineering, Penn State University, University Park, PA 16802, USA.
Micromachines
|March 27, 2025
概括
高温降解化 (GaN) 斯科特基屏障二极管 (SBD) 通过金属-GaN间扩散和缺陷产生. 接口上的这些电热和化学反应会在极端环境中导致设备故障.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 可靠性工程可靠性工程
背景情况:
- 基于化 (GaN) 的设备对于在苛刻条件下运行的高功率电子设备至关重要.
- 了解高温降解对于提高GaN设备的可靠性至关重要.
研究的目的:
- 阐明高温降解在GaN-on-sapphire Schottky屏障二极管 (SBD) 中的基本机制.
- 调查电偏差,温度和材料缺陷之间的相互作用对设备性能的影响.
主要方法:
- 在传输电子显微镜 (TEM) 中使用定制的热电芯片进行现场观测降解.
- 传输电子显微镜 (TEM),扫描传输电子显微镜 (STEM) 和能量分散式X射线光谱 (EDS) 用于材料分析.
- 几何相位分析 (GPA) 用于量化应变和格子扭曲.
主要成果:
- 最初的设备显示出高缺陷密度,这是由于GaN-蓝宝石网格和热不匹配.
- 高温 (300-455°C) 和偏差 (4-5V) 导致Au/Pd金属堆和GaN之间发生交互扩散和合金.
- 在接口上产生缺陷和应变局部化加速了金属原子的迁移,导致了Schottky接触失效.
结论:
- 缺陷介导的电热降解是高温GaN SBD的主要故障机制.
- 界面化学反应,特别是金属-GaN合金,极大地影响了设备的可靠性.
- 缓解初始缺陷和控制接口反应是极端环境中强大的GaN设备操作的关键.
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