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一种制造空腔SOI及其使用共振压力传感器验证的方法

Han Xue^1,2, Xingyu Li^1,2, Yulan Lu¹

¹State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.

|March 27, 2025

概括

一种新的Cavity在绝缘体 (Cavity-SOI) 制造方法使用干蚀刻,Au-Si粘合和CMP用于灵活的MEMS设计. 这种方法简化了生产并提高了性能,如高灵敏度的MEMS共振压力传感器所示.

科学领域:

材料科学材料科学材料科学
机械工程机械工程
纳米技术纳米技术

背景情况:

绝缘体上的空洞 (Cavity-SOI) 为微电子机械系统 (MEMS) 提供了设计灵活性.
传统的MEMS制造面临着复杂性和释放过程的挑战.

研究的目的:

开发和验证用于空腔SOI制造的新型微加工工艺.
为了证明MEMS设备的Cavity-SOI技术可行性,特别是共振压力传感器 (RPS).

主要方法:

干蚀刻的整合,晶圆级Au-Si优质粘合,以及化学机械抛光 (CMP).
使用空洞SOI方法设计和制造一个MEMS共振压力传感器 (RPS).
实验验证空洞形成,密封,深度控制和传感器性能.

主要成果:

干蚀实现了精确的腔体尺寸;Au-Si粘合确保了高效的密封;CMP控制了腔体深度.
洞内SOI启用了自发共振器释放,避免了HF释放问题,如下切和粘附.
该MEMS RPS显示出高灵敏度 (100.695 Hz/kPa),广泛的操作范围 (-10-60 °C, 1-120 kPa) 和低误差 (<0.012% FS).

结论:

拟议的Cavity-SOI制造方法简化了MEMS生产,克服了传统的局限性.
MEMS RPS的成功制造和性能验证了空腔-SOI方法的有效性和实用性.
这一突破使得用于各种工业应用的先进MEMS设备的开发成为可能.

关键词:

Si 欧性结合 AuSi 欧性结合在绝缘体上的腔.设备制造设备的制造.微电子机械系统微电子机械系统一个共振压力传感器.

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